Date & Time: Sunday, 19 January, 2025, 1:30pm – 5:30pm
Design, Advanced Packaging and Heterogeneous Integration Solutions for mmWave and Sub-THz Applications
Organizers: Mehmet Kaynak, Texas Instruments and Ahmet Cagri Ulusoy, Karlsruhe Institute of Technology
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Abstract
In mm-wave applications, RF routing within IC packages is crucial for ensuring signal integrity, efficiency, and reliability. At mm-wave frequencies, signal paths are highly sensitive to losses, interference, and parasitic effects. Optimized RF routing minimizes insertion loss, reduces crosstalk, and controls parasitics, which preserves signal power and enhances clarity. Package interaction with silicon impacts thermal management, preventing hotspots that can degrade performance. Integration with Antenna-on-Package (AoP) structures further emphasizes the need for precise routing to avoid mismatches and reflections, optimizing antenna performance. Reliable RF routing is essential for consistent manufacturing, especially in automotive radar, where high performance and robustness are mandatory. Proper RF routing in mm-wave radar packages thus plays a vital role in achieving the high fidelity and reliability required for these advanced applications.
In this workshop, we will deeply explore high-frequency technologies, heterogeneous integration, and advanced interconnect solutions for mmWave and sub-THz applications. We will explore the need for and innovative approaches to heterogeneous integration (HI), which involves integrating multiple dies and chiplets (e.g., CMOS, InP, and SiGe BiCMOS chips) on advanced packaging, to push the boundaries of high-frequency systems into new territories.
The workshop will include insightful presentations from both academia and industry, highlighting the latest trends and future design and technologies, HI, and advanced packaging. These talks will merge theoretical research with practical applications, offering a comprehensive view of the field’s progression.
Speakers
Development, Implementation, and Characterization of a Heterogenous Phased Array Antenna Module for 5G Communications
Jean-Oliver Plouchart, IBM Thomas J. Watson Research Center
Abstract: This talk discusses design and integration considerations of a scalable 24–30GHz 256-element phased array antenna module consisting of four 64-element tiles. This phased array module employs a heterogeneous integration approach to enable the effective and efficient integration of multiple ICs, bandpass filters, splitters, combiners, and decoupling capacitors in a multi-layered organic substrate which also integrates the 64 dual-polarized antenna array. This talk also introduces and addresses technical challenges that arise in the heterogeneous integration of such large mm-wave antenna-in-package (AiP) designs.
Bio: Jean-Oliver Plouchart pioneered and led the RF and mmwave SOI at the IBM Semi-conductor Research and Development Center which is used in billions of mobile devices. He has published more than 128 papers with 3 most cited papers at the RFIC conference. He also holds more than 80 patents. He is currently working as a Senior Research Scientist at the IBM T. J. Watson Research Center on technology and chip design from 2nm to 14nm for AI and quantum computing applications.
Advanced Packaging Solutions for mmWave Applications
Tanja Braun, Fraunhofer IZM
Abstract: In the last years, the increasing demand for ever higher data rates in wireless communication has exposed the limits of current sub-6 GHz communication systems and pushed the technology towards the exploration of the mmWave frequency spectrum. Systems operating at mmWave have to cope with much higher free space losses then in the sub-6 GHz frequency range. Moreover, the physical size of interconnects (e.g. chip-to-chip or chip-to-antenna) becomes comparable to the operating wavelength. Therefore, new packaging technologies are required, which also allow implementing large antenna arrays for massive MIMO and short interconnects to minimize package losses.
The presentation will introduce advanced packaging solution suitable for RF and mmWave applications as e.g. flip chip and interposer solutions, fan-out wafer level packaging or chiplet approaches. This also addresses topics as antenna-in-package solutions, shielding on package level, passive component integration or heterogeneous integration of III/V semiconductors with Si or SiGe in one package.
Bio: Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin. Tanja Braun is head of the group Assembly & Encapsulation Technologies. Recent research is focused on Fan-out Wafer and Panel Level Packaging technologies. In 2021 she received the Exceptional Technical Achievement Award from IEEE Electronics Packaging Society (EPS) and the IMAPS Sidney J. Stein Award for her work in the field of Fan-out Wafer and Panel Level Packaging.
Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and the IEEE EPS Region 8 Program Director.
Design and manufacturing challenges in mm-wave packaging and RF modules
Vatankhah Varnoosfaderani Mohammad, Texas Instruments
Abstract: Moving to mm-wave frequencies allowed us to implement a full radar system on a chip including its antennas. Designing antennas on the package of the IC, for mm-wave applications, poses a series of challenges that demand innovative solutions. Cost limitation forces us to use certain package structures for ease of manufacturing. It also pushes the limits of minimum possible size for the package to fit more devices in a panel. In addition to size and manufacturing limitations, performance including parameters such as radiation efficiency, bandwidth and isolation should not be sacrificed. The presentation would review some examples of challenges and solutions for antenna on package at millimeter wave frequencies for automotive and industrial radar applications.
Bio: Dr. Vatankhah is a dedicated expert in electromagnetic, microwave, and RF/antenna engineering, having earned a PhD from Griffith University in Australia. With a focus on innovation, he has contributed to more than 20 US patents and patent applications, primarily in the areas of antennas, antenna arrays, microwave, and RF circuits. Dr. Vatankhah has also made valuable contributions through 11 journal papers and conference presentations. His professional journey has included roles at CommScope and Ericsson, and he currently leads a team in Texas Instruments’ radar group, working on packaging and EM/antenna design, with a focus on antenna on package and launch on package technologies at mm-wave frequencies.
Highly Integrated D- and H-Band Transceivers for Low-Cost Radar Applications
Ahmet Cagri Ulusoy, Institute of RF Engineering and Electronics, Karlsruhe Institute of Technology
Abstract: Silicon-based semiconductor technologies have been improving at an incredible pace in the last decades with cut-off frequencies now exceeding 0.5 THz. This enables microwave engineers to investigate new solutions, integrating many functionalities into a single chip for applications beyond 100 GHz. In this talk, we will introduce D- and H-band transceivers making use of state of the art SiGe BiCMOS technology. We will discuss a unique balanced mixer-first topology and output power enhancement methods to achieve significant improvement in dynamic range. In addition, integration with on-chip antenna and a silicon lens will be presented for range enhancement. With careful optimization of passive components, the highly miniaturized transceivers are suitable for future low-cost commodity radar applications.
Power Amplifiers: System Challenges, Simulation and Latest Architectures
Organizers: Dr. John Dooley, Maynooth University, Ireland and Dr. Gregor Lasser, Chalmers University of Technology, Sweden
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Abstract
Wireless systems are increasingly used to address some of the world’s most pressing societal challenges, but deployment of these solutions also introduces specific technical challenges. A critical component in many wireless communication and sensing systems is the power amplifier (PA). Given the broad range of applications, there is a growing need for PAs that can operate across various power levels, support multiple frequency bands, offer wider bandwidths, and maintain high power efficiency. This has significantly expanded the role and design responsibilities of PA engineers.
In modern wireless communication systems, design specifications for power amplifiers now extend beyond their traditional input and output ports to encompass broader system-level requirements. This workshop will bring together insights from industry and academic leaders on key system-level considerations, including cellular network infrastructure, non-terrestrial communication link simulation, and innovative PA designs that are pushing the boundaries of wireless system performance.
Bios
Dr. David Gustafsson received his Ph.D. degree in Microtechnology and Nanoscience from Chalmers University of Technology, Gothenburg, Sweden in 2014. Since then, he has been with Ericsson Research, Gothenburg, where he is currently leading Ericsson’s analog front-end and power amplifier research program.
Dr. Aleksander Bogusz received MEng and PhD degrees from the School of Engineering at Cardiff University, Wales, UK, in 2012 and 2022, respectively. He works as a Research Assistant at the Centre for High Frequency Engineering at Cardiff University. Additionally, he is a Senior Research Fellow at the Compound Semiconductor Applications Catapult, Newport, UK, where he focuses on the non-linear modelling of GaN HEMT devices. His research interests include the design and characterization of efficient broadband power amplifiers, efficiency enhancement techniques, and RF/MW/mm-wave instrumentation.
Dr. Sekhar Rajendran (Member, IEEE) received the B.Tech. degree in electronics and communication from the Cochin University of Science and Technology, India, in 2008, the M.Tech. degree in signal processing and control systems from the National Institute of Technology, Hamirpur, India, in 2014, and the Ph.D. degree in electrical engineering from the University at Buffalo and The State University of New York, in June 2021. Prior to this role, he was an Assistant Professor with the Electronics and Communication Department, Rajagiri School of Engineering and Technology, India, from 2015 to 2016, and has also worked in the wireless industry as a Network Subsystem Engineer at Sasken Technologies Ltd., from 2009 to 2011. He is currently a Senior Applications Engineer in the RF and Mixed Signal Team in Mathworks. His current research interests include: wireless physical layer security, reconfigurable wireless communications, wireless sensing and non-terrestrial network digital twins.
Dr. Taylor Wallis Barton (Senior Member, IEEE) received the Sc.B., M.Eng., E.E., and Sc.D. degrees from the Massachusetts Institute of Technology, Cambridge, MA, USA. She was a Postdoctoral Associate with the MIT Microsystems Technology Laboratories and then an Assistant Professor with the University of Texas at Dallas, Richardson, TX, USA. In 2016, she joined the Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO, USA, where she is currently an Assistant Professor and holds the Lockheed Martin Faculty Fellowship. Dr. Barton’s RF Power and Analog Laboratory investigates engineering challenges related to RF and microwave active circuit design, specifically in RF front-ends for communications, imaging, and telemetry applications.
Radio Communication and Radio Sensing for Public Authorities
Organizers: Dr. Thomas Ussmueller, B&E antec Nachrichtentechnik GmbH, Nuremberg, Germany, Dr. Christian Schulz, Institute of Microwave Systems, Ruhr University Bochum, Bochum, Germany, and Francesca Schenkel, M.Sc., Institute of Microwave Systems, Ruhr University Bochum, Bochum, Germany
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Abstract
In an era where safety and security are paramount, radio sensing technologies offer innovative solutions across various domains of public safety and emergency response. This workshop brings together leading experts to discuss the latest advancements, applications, and challenges in the field of radio sensing and communication for public authorities. Key topics will include the integration of terrestrial and satellite-based systems to enhance the monitoring and coordination of air traffic, especially in remote and oceanic areas. In addition, the importance of secure and reliable communication channels in safety operations will be addressed. Potential vulnerabilities in radio communication and strategies to mitigate risks will be discussed, ensuring the integrity and confidentiality of critical information. Another focal point will be the application of radar technology in fire sensing, offering unique advantages over traditional optical and thermal methods. Participants will explore the principles of radar sensing, its ability to operate in various environmental conditions, and the ongoing challenges in signal interpretation and sensor integration. The workshop will also delve into innovative radar-based technologies for detecting life signs, designed to be deployed on reconnaissance robots or drones. This will cover the potential for these systems to revolutionize search and rescue operations, providing critical capabilities in disaster response scenarios. The workshop aims to provide a comprehensive overview of the current state and future potential of radio sensing technologies, offering valuable insights for researchers, practitioners, and policymakers dedicated to enhancing safety and security through technological innovation.
Bios
Hands-On Workshop for Signal Analyzing Measurement
Organizers: Herrmann Boss, Paul Peterson, Rohde&Schwarz
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Abstract
This workshop will provide a hands-on learning experience in generating and measuring complex modulated signals. Participants will gain practical skills in utilizing common measurement techniques with the use of spectrum analyzers and vector signal generators. Through interactive sessions, attendees will explore the generation of various modulation schemes such as amplitude and frequency modulation, phase shift keying (PSK), and quadrature amplitude modulation (QAM). They will also learn to analyze the resulting signals, measure key parameters like carrier frequency, modulation index, and signal-to-noise ratio (SNR), and identify potential impairments. By the end of the workshop, participants will have a solid understanding of the fundamental principles of signal modulation and the ability to apply these techniques effectively in their research or engineering projects.
Bios
